Plasma display panel

ABSTRACT

The plasma display panel disclosed has a front substrate and a rear substrate positioned to face each other. The front substrate includes display electrodes provided with scan electrodes and sustain electrodes, and a light-shield provided on a non-discharge area between display electrodes. A rear substrate includes phosphor layers to emit light by discharge. The display electrodes are composed of transparent electrodes, and bus electrodes. The bus electrodes are composed of a plurality of electrode layers and at least one of the electrodes is composed of a black layer having a product of the resistivity and layer thickness of not larger than 2 Ωcm 2 . A light-shield is composed of a black layer with the resistivity of not smaller than 1×10 6  Ωcm.

TECHNICAL FIELD

The present invention relates to a plasma display panel for plasmadisplay device known as a large-screen, flat and lightweight displaydevice.

BACKGROUND ART

The plasma display panel (hereafter referred to as PDP) generatesultra-violet ray in gas discharge, and excites phosphors to emit lightby the ultra-violet ray to perform image displaying.

The plasma display panels are roughly divided into AC powered and DCpowered in driving method, and into surface discharge and counterdischarge in discharging method. Currently, however, surface dischargeAC powered with three-electrode structure has become the mainstreamtechnology due to capabilities for high definition display, large-sizedscreen, simple structure and easy manufacturing method.

The AC powered PDP consists of a front substrate and a rear substrate.The front substrate is a substrate made of glass or the like on which:display electrodes including scan electrodes and sustain electrodes;light-shields between adjacent display electrodes; a dielectric layercovering the electrodes; and a protective layer to cover the layersfurther, are formed. The rear substrate is a substrate made of glass orthe like on which: a plurality of address electrodes crossing thedisplay electrodes on the front substrate; a dielectric layer coveringthe electrodes; and ribs on the dielectric layer are formed. The frontsubstrate and rear substrate are positioned facing each other so as toform discharge cells at crossings of discharge electrodes and dataelectrodes, and the discharge cells are provided with phosphor layersinternally.

The display electrode is provided with a transparent electrode and a buselectrode. The bus electrode has a black electrode to block incominglight reflection and a low resistance metal-rich electrode.

More recently, the PDP attracts increasing attention among flat paneldisplay technologies and is used widely as a display device for a placecrowded with many people or to enjoy images at a large screenhome-theater. This is because the PDP can respond to display faster andcan be produced in large sizes easier than LCD, with wide viewing anglesand a high picture quality due to self-lighting.

As to the configuration of black electrodes to compose the displayelectrode and the light-shield provided between the display electrodes,an example is disclosed in Japanese Patent Unexamined Publication No.2002-83547: these electrodes are formed of a plurality of layers on thesubstrate and one of a plurality of the layers is a black layer, havinga higher sheet resistance than the other layers, which forms thelight-shields as well as the black electrodes integrally.

However, when the black layer is commonly used to the light-shield, asmaller resistance of the black layer would increase capacitance in thelight-shield, causing an increase in power consumption. Contrarily, alarger resistance of the black layer would increase the resistance oftransparent electrode composing the display electrode, causing acritical problem of poor image quality.

DISCLOSURE OF THE INVENTION

The PDP disclosed in the present invention has a pair of substrates thatinclude at least one transparent front substrate and are positioned toface each other so that discharge spaces are formed between thesubstrates.

The front substrate has display electrodes provided with scan electrodesand sustain electrodes, and light-shields formed on non-discharge areasbetween the display electrodes.

The rear substrate has phosphor layers to emit light by discharge. Thedisplay electrode has a transparent electrode and a bus electrode. Thebus electrode includes a plurality of electrode layers and at least oneof the electrode layers is a black layer with a product of a resistivityand a layer thickness of not larger than 2 Ωcm². The light-shield is ablack layer with a resistivity of not smaller than 1×10⁶ Ωcm.

The configuration can prevent poor discharge due to voltage drops of thebus electrode in the black electrode and due to interferences of voltagewave shapes from the light-shield, enabling to reduce man-hour of thePDP manufacturing process and to provide a PDP with a high picturequality.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a cross-sectional perspective view showing the mainstructure of the plasma display panel used in the first exemplaryembodiment of the present invention.

FIG. 2 illustrates a cross-sectional view showing the structure of thedisplay electrodes and light-shield of the plasma display panel used inthe first exemplary embodiment of the present invention.

FIG. 3 illustrates a cross-sectional view showing the structure of thedisplay electrodes and light-shield of the plasma display panel used inthe second exemplary embodiment of the present invention.

FIG. 4 illustrates a view showing a method to get a product of theresistivity of the black layer of the light-shield and the layerthickness.

FIG. 5 illustrates a view showing a method to get the resistivity of theblack layer of the light-shield.

DETAILED DESCRIPTIONS OF THE INVENTION

Now, the PDP used in the exemplary embodiments of the present inventionare described with reference to drawings.

The First Exemplary Embodiment

FIG. 1 illustrates a cross-sectional perspective view showing the mainstructure of the plasma display panel used in the first exemplaryembodiment of the present invention.

PDP 1 comprises front substrate 2 and rear substrate 5 positioned toface each other so that narrow discharge spaces 16 are formed as shownin FIG. 1. Front substrate 2 has display electrodes 6 including scanelectrodes 4 and sustain electrodes 5 both arranged in stripe-shaped onglass substrate 3 so as to form surface discharge gaps. Scan electrodes4 and sustain electrodes 5 are composed of transparent electrodes 4 aand 5 a, and bus electrodes 4 b and 5 b respectively.

Transparent electrodes 4 a and 5 a are for instance indium tin oxide(ITO) layer provided on glass substrate 3 by electron beam evaporation.A flat ITO layer is formed on glass substrate 3 before patterningresists on the layer to form transparent electrodes 4 a and 5 a byetching. SnO₂ can be adopted also as a material for transparentelectrodes 4 a and 5 a.

Bus electrodes 4 b and 5 b are composed of a plurality of electrodelayers, and at least one of the electrode layers is a black layer formedfrom a black material common to light shield 7. The black material is amixture of: a black pigment (black oxides such as Cr—Co—Mn series,Cr—Fe—Co series or the like); a glass frit (PbO—B₂O₃—SiO₂ series,Bi₂O₃—B₂O₃—SiO₃ series or the like); and a conductive material. Aphotosensitive black paste composed of the black material added with aphoto-polymerization initiator, photo-hardening monomer, organic solventor the like forms the black layer by the screen-printing method or thelike. Moreover, the electrode layers or conductive layers are providedon the black layers. Specifically, the material used for the conductivelayers is a photosensitive Ag-based paste including: a conductivematerial having Ag or the like; a glass frit (PbO—B₂O₃—SiO₂ series,Bi₂O₃—B₂O₃—SiO₃ series or the like); a photo-polymerization initiator; aphoto-hardening monomer; and an organic solvent or the like. A layer ofthe photosensitive Ag-based paste formed on the black layers byscreen-printing is patterned to form the conductive electrode layers bythe photolithography.

Since formed from the black material common to bus electrode 4 b and 5b, light shield 7 can be formed at the same time when the black layersare formed on transparent electrode 4 a and 5 a, thereby enabling toreduce man-hours of the PDP manufacturing process and to improvematerial usage rate. That is, a layer of the black material, a materialfor the black layer and light shield 7 as well, is formed onnon-discharge area located between display electrodes 6 adjacent to eachother. The black layers of bus electrodes 4 b and 5 b, and light shield7 can be formed at the same time by patterning bus electrodes 4 b and 5b, and light shield 7 respectively. Here, the black layer can be colorednot only in true black but also in any blackish color such as graycolor.

Subsequently, display electrodes 6 and light shield 7 formed as aboveare covered by dielectric layer 8. Dielectric layer 8 is formed from apaste containing lead-based glass materials coated by for instancescreen printing and is dried before sintering. Then, dielectric layer 8is covered by protective layer 9 to complete front substrate 2.Protective layer 9 composed of for instance MgO is formed by vacuumevaporation or sputtering.

Next, rear substrate 10 has address electrodes 12 formed on glass 11arranged in stripe-shaped. Specifically, a material for addresselectrodes 12, a photosensitive Ag-based paste or the like, is appliedto form a layer on glass substrate 11 by screen printing or the like andthen the layer patterned by lithography or the like before sintering.

Subsequently, address electrodes 12 formed as above are covered bydielectric layer 13. Dielectric layer 13 is formed from a pastecontaining lead-based glass materials coated by for instancescreen-printing and dried before sintering. Instead of printing thepaste, laminating a precursor to dielectric layer molded in film-likebefore sintering can form the dielectric layer.

Next, ribs 14 are formed arranged in stripe-shapd. Ribs 14 can be formedfrom a layer, composed of a photosensitive paste containing mainlyaggregates such as Al2O3 and glass frits and applied by die-coating orscreen-printing, patterned by photo-lithography before sintering.Additionally, ribs can be formed from the paste, containing lead-basedglass materials, coated repeatedly in a certain intervals by forinstance screen-printing and dried before sintering. Here, gapdimensions between ribs 14 shall be of the order of 130 to 240 μm in thecase of for instance 32 to 50 inch HD-TV.

Phosphor layers 15R, 15G and 15B having phosphor powders red (R), green(G) and blue (B) respectively are formed in a groove between two ribs14. Each color of phosphor layer 15R, 15G and 15B is formed by; coatingand drying a paste-like phosphor suspension composed of a phosphorpowder and organic binders; and subsequently sintering it to burn offthe organic binders at the temperature of 400 to 590° C., allowing thephosphor particles to adhere.

Front substrate 2 and rear substrate 10 produced as described above arepositioned facing each other so that display electrodes 6 of frontsubstrate 2 generally cross address electrodes 12 of rear substrate 10,and sealants such as sealing glasses applied into peripheral portionsare sintered for instance at 450° C. or so for 10 to 20 minutes to forman air-tight sealing layer (not shown). Then, the inside of dischargespaces 16, once pumped to a high vacuum (for instance 1.1×10⁻⁴ Pa), arefilled with a discharge gas for instance Ne—Xe 5% at the pressure of66.5 kPa (500 torr) to complete PDP 1.

By the configuration shown in FIG. 1, the crossing points of displayelectrodes 6 and address electrodes 12 in discharge spaces 16 work asdischarge cells 17 (a unit discharge cell).

Additionally, the materials for the black layer include black pigments,conductive substances and frit glass in this exemplary embodiment,wherein ruthenium oxide can be used as a conductive substance to controlthe resistivity of the black layer by the additive amount. Some metalscan also be used as a conductive substance (for instance, silver powder)to control the resistivity of the black layer by the additive amount.

The structure and electric property of display electrode 6 andlight-shield 7 are described more in detail.

FIG. 2 is a cross-sectional view showing the structure of the displayelectrode 6 and light shield 7 of the PDP in the first exemplaryembodiment of the present invention. Scan electrodes 4 and sustainelectrodes 5, both included in display electrodes 6, and light-shields 7are provided on glass substrate 3 as shown in FIG. 2. A pair of scanelectrode 4 and sustain electrode 5 make up display electrode 6, andnon-discharge areas between respective display electrodes 6 adjacent toeach other provide light-shields 7. Scan electrode 4 and sustainelectrode 5 comprise: transparent electrode 4 a and 5 a, composed ofSnO₂ or ITO, formed on glass substrate 3; and bus electrode 4 b and 5 bprovided on transparent electrode 4 a and 5 a at the side oflight-shield 7. Bus electrode 4 b and 5 b have a double-layeredstructure including black layer 18 a and conductive layer 19 provided onblack layer 18 a.

Black layer 18 a of bus electrode 4 b and 5 b is formed from the samematerial as light-shield 7, and black layer 18 a and black layer 18 bare formed connected. That is, display electrodes 6 adjacent to eachother are connected via black layer 18 a and black layer 18 b oflight-shield 7.

The product of the resistivity of black layer and layer thickness shallbe not larger than 2 Ωcm², and the resistivity of light-shield 7composed of black layer 18 b shall be not smaller than 1×10⁶ Ωcm, in theexemplary embodiments of the present invention.

When adjacent display electrodes 6 are electrically connected each othervia light-shield 7, the resistivity of smaller than 1×10⁶ Ωcm for blacklayer 18 b of light-shield 7 would cause for instance a part of currentflowing through one of display electrodes 6 to flow into anotheradjacent display electrode 6 through light-shield 7. Eventually, voltagewave shapes of a display electrode will interfere with voltage waveshapes of another display electrode, causing to prevent required voltagewave shapes from sending to discharge cells

The materials for the black layers, however, have a high resistivity oflarger than 1×10⁶ Ωcm so that black layers 18 b have a resistance highenough enable to overcome such problems practically, in the exemplaryembodiments of the present invention.

Additionally, a higher resistivity for black layer 18a formed from thesame material as light-shield 7 would cause a phenomenon for dischargecells not to supply voltage required, due to voltage drops occurring inblack layer 18 b at the current flow from conductive layer 19 totransparent electrodes 4 a and 5 a. The phenomenon will begin to occurat larger than 0.5 Ωcm² for the product of the resistivity and layerthickness, and becomes noticeable at larger than 2 Ωcm². The specifiedvalue of not larger than 2 Ωcm² for the product of a resistivity andlayer thickness in the present invention, however, is high enough toovercome such problems practically.

Following is the reason why the product of resistivity and layerthickness is adopted to define the electrical resistance for black layer18 a, although the electrical resistance is generally defined by theresistivity or sheet resistance.

The relation between the resistance and resistivity of the blackelectrode is given by the formulaR=ρ×t/S,

where R is the resistance, ρ the resistivity, t the layer thickness andS the electrode area.

As described above, though the resistivity can be calculated by theresistance, layer thickness and electrode area, the resistivity valuewould be smaller than the resistivity of black layer 18 b oflight-shield 7 formed from apparently the same material from thefollowing reasons.

That is, black layer 18 a and conductive layer 19 both formed by thicklayer manufacturing processes would produce uneven layer thickness withsometimes thinner portions, causing the portions with low resistancepartially. Conductive substances of conductive layers 19 diffused intoblack layers 18 a would reduce the resistivity of black layers 18 a.Moreover, when patterning bus electrodes 4 b and 5 b by exposing fordevelopment, over-etching black layer 18 a in developing process couldlose black layer 18 a provided under conductive layer 19, causingtransparent electrode 4 a to touch conductive layer 19 directly.

Although resistance R can be given from the measurement of voltage vs.current characteristics, and electrode area S from the measurement ofexterior dimensions, to measure the layer thickness and resistivity ofblack layer 18 a accurately is very difficult due to the above reasons.In the present invention, therefore, the electrical properties shall bespecified by the product of the resistivity and layer thickness. Theproduct is calculated easily with the resistance R and electrode area Sgiven by the measurement method described later.

The Second Exemplary Embodiment

FIG. 3 is a cross-sectional view showing the structure of displayelectrodes 6 and light-shield 7 of the PDP used in the second exemplaryembodiment of the present invention. The second exemplary embodimentdiffers from the first exemplary embodiment in that the structure hasslit 20 provided between display electrode 6 and light-shield 7 toinsulate both sides electrically as shown in FIG. 3, and that theresistivity of light-shield 7 shall be not less than 1×10⁶ Ωcm, leavingthe other configurations the same as the first exemplary embodiment.

Slit 20 is formed by patterning after black layer 18 a and light-shield7 of bus electrodes 4 b and 5 b are formed integrally.

Since display electrode 6 and light-shield 7 are insulated electricallyin the second exemplary embodiment, voltage wave-shape of one displayelectrode 6 will never interfere with another display electrode 6. Theconfiguration enables to select a lower resistance material for blacklayer 18 a composing bus electrode 4 b and 5 b, and for black layer 18 bcomposing light-shield 7.

However, a low resistance of black layer 18 b of light-shield 7 wouldincrease the capacitance of a space between display electrodes 6adjacent to each other via light-shield 7 (shown in space A in FIG. 3),causing a problem of increase in power consumption in PDP operation. Theresistivity of black layer 18 b, therefore, cannot be reduced needlesslybut is necessary to have a certain level of insulation to restrain theincrease in capacitance and power consumption. Specific resistivity ofblack layer 18 b differs in the panel structure, the materials used forglass substrate, dielectric or the like, but the resistivity of not lessthan 1×10⁶ Ωcm will be able to restrain the increase in powerconsumption.

Now, the measurement method of the product of the resistivity and layerthickness of black layers 18 a and 18 b, or the measurement method ofthe resistivity is described in detail.

Firstly, the measurement method of the product of the resistivity andlayer thickness of black layers 18 a of bus electrodes 4 b and 5 b isdescribed with reference to FIG. 4. FIG. 4 is to show a flow to get aproduct of the resistivity and layer thickness for the black layer.

The manufacturing method of a measuring sample is described first. Flatlayer 32 is formed on glass substrate 31 as a transparent electrode. Nopatterning is necessary in this process (FIG. 4A). Then, aphoto-sensitive black paste is coated on transparent electrode 32 by aprinting method or the like and then is dried to form dried black flatlayer 33 (FIG. 4B). Next, a photosensitive conductive paste is coated ondried black flat layer 33 by a printing method or the like and then isdried to form dried conductive flat layer 34 (FIG. 4C). Dried black flatlayer 33 and dried conductive flat layer 34 produced as above areexposed with exposure mask 35 attached so as to form 100 μm (W)×20 mm(L) with respective gaps of 100 μm (G) (FIG. 4D). The developing andsintering processes will form double-layered electrode patterns composedof stripe-shaped black layer 38 and conductive layer 39 on transparentelectrode 32 on glass substrate 31 (FIG. 4E).

Resistance value (R) of the gap between electrode patterns adjacent toeach other are measured by using probes 36A and 36B ofresistance-measuring-equipment 37 as shown in FIG. 4E. The line width(W) and length (L) of the sample are measured by the length-measuringmachine. Fracture cross sections of black layer 38 are observed and thenthe layer thickness (d) is measured by the scanning electron microscopeor the like. The results are substituted into the formula ρ×t=R×W×L, tocalculate the product of resistivity ρ and layer thickness t. Since thelayer thickness of black layer 38 is generally uneven, the average oflayer thickness of black layer 38 shall be the layer thickness of blacklayer 38 here. Although the calculation results would include theresistance of transparent electrode 32 practically, it can be neglectedsince the resistance of transparent electrode 32 is much smaller thanthe resistance of black layer 38.

Next, the measurement method for the resistivity of the black layer oflight-shield is described with reference to FIG. 5. FIG. 5 is a viewshowing a flow to get the resistivity for the black layer of thelight-shield.

Firstly, a photo-sensitive black paste is coated on glass substrate 41by the printing method or the like and then is dried to form dried blackflat layer 42 (FIG. 5A). Then, the full surface of dried black flatlayer 42 is exposed. Next, a photosensitive conductive paste is coatedby the printing method or the like and then is dried to form driedconductive flat layer 43 (FIG. 5B). Dried black flat layer 42 and driedconductive flat layer 43 produced as above are exposed with exposuremask 44 attached so as to form 100 μm (W2)×20 mm (L2) with respectivegaps of 5 m (G2) (FIG. 5C). The following development and sinteringprocesses will form conductive electrodes 47 on black layer 42 on glasssubstrate 41 (FIG. 5D).

Resistance (R2) of the gap between conductive electrodes 47 adjacent toeach other are measured by using probes 45A and 45B ofresistance-measuring-equipment 46 as shown in FIG. 5D. The length (L2)and gap (G2) of the sample are measured by the length-measuring machine,and the layer thickness (d2) of the light-shield is by the sensing pintype roughness gauge. The results are substituted into the formula:ρ2=R2×d2×L2/G2,to calculate the resistivity ρ2 of the black layer of light-shield.

Although the calculation results will include partial resistancecomponents of black layer 42 under conductive layer 47 practically, itcan be neglected if G2 is made up large enough than W2.

Table 1 shows the comparison of the power consumption and displaycharacteristics varying the properties of black layer 18 a and 18 b atnon-brightness for the PDP, provided with slit 20 between black layer 18b of light-shield 7 and display electrode 6 to insulate light-shield 7from display electrode 6 electrically, described in the second exemplaryembodiment. TABLE 1 Product of resistivity Resistivity of and layerthickness of black layer for Conductive Power black layer for buslight-shield materials in Starting consumption at electrode [Ωcm²] [Ωcm]black layer characteristic nonbrightness Reference No. 1 5 × 10⁻² 1 ×10² ruthenium ◯ Large Comparative oxide + silver example 1 No. 2 3 ×10⁻¹ 2 × 10⁴ ruthenium oxide ◯ Largish Comparative example 2 No. 3 8 ×10⁻¹ 1 × 10⁵ ruthenium oxide ◯ ◯ Present invention 1 No. 4 2 × 10⁰ 1 ×10⁸ ruthenium oxide ◯ ◯ Present invention 2 No. 5 6 × 10⁰ 5 × 10²ruthenium oxide ◯ ◯ Comparative Δ a few example 3 No. 6 1 × 10² 5 × 10¹¹— X ◯ Comparative example 4 No. 7 2 × 10⁻¹ 5 × 10¹¹ — ◯ ◯ Conventionalexample 1

In table 1, the resistivity of black layers 18 a and 18 b are controlledby varying the content of ruthenium-based oxide, used as a conductivematerial, for sample No. 2 to 5. Silver powder is added toruthenium-based oxide for sample No.1 and no conductive material is usedfor No. 6. Sample No. 7 is a conventional example where the light-shieldand black layer of bus electrode are manufactured by using differentmaterials respectively.

The power consumption at non-brightness means a power consumed todisplay black in full-screen to compare with the conventional exampleNo.7. The starting characteristic shows whether each PDP can start atthe voltage on which conventional example No. 7 operates fully.

Sample no. 1 and no. 2 provided with light-shield having resistivitylower than 2×10⁴ Ωcm show a larger power consumption at non-brightnessthan conventional example no. 7, and the power consumption atnon-brightness increases with decreasing resistivity of light-shield asshown in table 1. Additionally, the power consumption at non-brightnesssaturates with the resistivity higher than 1×10⁵ Ωcm for thelight-shield.

The product of the resistivity of black electrode and layer thicknesshigher than 0.5 Ωcm² causes a phenomenon of a little decrease inbrightness in a portion of the screen due to a voltage drop to besupplied to the discharge spaces. The phenomenon becomes more noticeablein sample no. 5 and no. 6 where the product of the resistivity of blacklayer and layer thickness increases higher than 2 Ωcm², so thatnon-brightness portions or decreases in brightness are observed in wholescreen.

However, sample no. 3 and no. 4 of the present invention show niceresults in both the power consumption at non-brightness and startingcharacteristic.

INDUSTRIAL APPLICABILITY

The present invention as described above can reduce man-hour of PDPmanufacturing process and can provide PDP apparatus capable ofdisplaying high quality images. The technology will be useful forlarge-sized screen display.

1. A plasma display panel having a pair of substrates with at least onetransparent front side and positioned to face each other so thatdischarge spaces are formed between the substrates comprising: a frontsubstrate having display electrodes provided with scan electrodes andsustain electrodes, and light-shields formed on a non-discharge areabetween the display electrodes; and a rear substrate having phosphorlayers to emit light by discharge, wherein the display electrodecomprises a transparent electrode and a bus electrode; the bus electrodeincludes a plurality of electrode layers; and at least one of theelectrode layers is composed of a black layer with a product of aresistivity and a layer thickness of not larger than 2 Ωcm² and thelight-shield is composed of a black layer with a resistivity of notsmaller than 1×10⁶ Ωcm.
 2. A plasma display panel having a pair ofsubstrates with at least one transparent front side and positioned toface each other so that discharge spaces are formed between thesubstrates comprising: a front substrate having display electrodesprovided with scan electrodes and sustain electrodes, and a light-shieldformed on a non-discharge area between the display electrodes; and arear substrate having phosphor layers to emit light by discharge,wherein the display electrode comprises a transparent electrode and abus electrode; the bus electrode includes a plurality of electrodelayers; at least one of the electrode layers is composed of a blacklayer with a product of a resistivity and a layer thickness of notlarger than 2 Ωcm² and the light-shield is composed of a black layerwith a resistivity of not smaller than 1×10⁶ Ωcm; and the displayelectrode and the light-shield are electrically insulated.
 3. The plasmadisplay panel of claim 1, wherein the black layer includes at least ablack pigment and a conductive material.
 4. The plasma display panel ofclaim 3, wherein the conductive material is an oxide including one ofruthenium and ruthenium oxide.
 5. The plasma display panel of claim 3,wherein the conductive material is a metal conductive material.
 6. Theplasma display panel of claim 5, wherein the metal conductive materialincludes at least one of Ag, Cu, Pd, Pt and Au.
 7. The plasma displaypanel of claim 2, wherein the black layer includes at least a blackpigment and a conductive material.
 8. The plasma display panel of claim7, wherein the conductive material is an oxide including one ofruthenium and ruthenium oxide.
 9. The plasma display panel of claim 7,wherein the conductive material is a metal conductive material.
 10. Theplasma display panel of claim 9, wherein the metal conductive materialincludes at least one of Ag, Cu, Pd, Pt and Au.